Well initialy I'd like to apologize for accidently deleting comments from the last post. This post is an extenssion to the previous post, and aims to address each comment and clear any misconceptions

To begin, many don’t realize that they have a PC heating problem, because of the design of your case. If you are a user who uses the PC over prolonged period’s tardy performance will become more obvious, this is a result of over heating. My ideas designed on the previous post outline efficient cooling methods.

Note: CPU’s attached to the MB or unattached wouldn’t result in a heating difference

-Trying to build pressure in the lower section of the box could result in the heat damaging other hardware components.

Notebook cooling is also a issue, well in all honesty there is very little one can do about this issue. But to say increase memory usage leads to increased heating is a major misconception. Software like fire-fos is not an actual contributor to you’re machines heating. Using newer battery packs should be helpful.

Cooling pads is an affordable option.

·         Ice cooling pads: similar to the gel icepacks you would use for injuries, you would just leave it in the refrigerator and then pull it out and leave it under you’re notebook for a few minutes, very effective but only over a short period of time

·         An Cooling – Getting multiple fans under you’re notebook may not be the most aesthetic but it is effective and over long periods, and also very cheap

·         Elevated docking – The idea of elevated docks, is to get the air flowing more quickly through the bottom of the notebook using the air in the room to cool it, energy efficient and it works, if your room temperature is usually cold  

Note: The more available RAM – or physical memory you have on your machine would in fact mean that the swap file usage {swapping from using the RAM instead of using the Hard drives, paging file, service, would mean lower hard-disk, battery usage and thus lower heating.

Thank you all very much for you’re comments.